Radioelektronikos terminų žodynas. – Vilnius : BĮ UAB „Litimo“. Kazimieras Gaivenis, Gytis Juška, Vidas Kalesinskas. 2000.
assembly in package — surinkimas į korpusą statusas T sritis radioelektronika atitikmenys: angl. assembly in package; package assembly vok. Verkapselung, f rus. сборка в корпус, f pranc. assemblage en boîtier, m … Radioelektronikos terminų žodynas
Package on package — (PoP) is an integrated circuit packaging technique to allow vertically combining discrete logic and memory ball grid array (BGA) packages. Two or more packages are installed on top of one another, i.e. stacked, with a standard interface to route… … Wikipedia
Assembly modelling — is technology and methods used by Computer aided design and Product visualization computer software systems to handle multiple files that represent components within a product. The components within an assembly are represented as solid or surface … Wikipedia
Package management system — A package management system is a collection of tools to automate the process of installing, upgrading, configuring, and removing software packages from a computer. Linux and other Unix like systems typically manage thousands of discrete… … Wikipedia
assembly in plastic package — surinkimas į plastikinį korpusą statusas T sritis radioelektronika atitikmenys: angl. assembly in plastic package; plastic packaging vok. Plastverkappung, f rus. сборка в пластмассовый корпус, f pranc. assemblage en boîtier plastique, m … Radioelektronikos terminų žodynas
Parliamentary Assembly of the Council of Europe - Resolution 1549 (2007) Functioning of democratic institutions in Ukraine — The information below is a copy of the relevant report and resolution passed by The Parliamentary Assembly of the Council of Europeon April 192007 concerning the Ukrainian Political Crisisand Decrees of The President, Viktor Yushchenko dismissing … Wikipedia
Quad-flat no-leads package — 28 pin QFN, upside down to show contacts and thermal/ground pad Flat no leads packages such as QFN (quad flat no leads) and DFN (dual flat no leads) physically and electrically connect integrated circuits to printed circuit boards. Flat no leads … Wikipedia
Apollo Lunar Surface Experiments Package — The Apollo Lunar Surface Experiments Package (ALSEP) comprised a set of scientific instruments placed by the astronauts at the landing site of each of the five Apollo missions to land on the Moon following Apollo 11 (Apollos 12, 14, 15, 16, and… … Wikipedia
Dual in-line package — PDIP redirects here. PDIP may also refer to Indonesian Democratic Party – Struggle. Three 14 pin (DIP14) plastic dual in line packages containing IC chips … Wikipedia
Sequence assembly — In bioinformatics, sequence assembly refers to aligning and merging fragments of a much longer DNA sequence in order to reconstruct the original sequence. This is needed as DNA sequencing technology cannot read whole genomes in one go, but rather … Wikipedia
